The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
May. 27, 2011
Han-chung Chen, Taichung County, TW;
Chun-yi Wu, Taichung, TW;
Shih-cheng Wang, Changhua County, TW;
Chin-mei Huang, Taichung, TW;
Tsui-chuan Wang, Taichung County, TW;
Pei-fang Tsai, Taichung County, TW;
Han-Chung Chen, Taichung County, TW;
Chun-Yi Wu, Taichung, TW;
Shih-Cheng Wang, Changhua County, TW;
Chin-Mei Huang, Taichung, TW;
Tsui-Chuan Wang, Taichung County, TW;
Pei-Fang Tsai, Taichung County, TW;
Wintek Corporation, Taichung, TW;
Abstract
A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.