Chun-Wei Liao

**Title: Inventor Profile: Chun-Wei Liao**

Introduction

Chun-Wei Liao is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of semiconductor devices. With an impressive portfolio of five patents, he has made remarkable strides in enhancing manufacturing techniques within the semiconductor industry.

Latest Patents

Among Chun-Wei Liao's latest inventions is a groundbreaking **Method of Manufacturing Semiconductor Devices**. This innovative method involves directing a hydrophobic solvent as a gas to flow over a bevel region of a wafer. By depositing a layer of the hydrophobic solvent on both the upper and lower bevel regions of the wafer, this technique enables effective blocking of a photo resist material during processing operations.

Another notable patent is the **Method of Storing Photoresist Coated Substrates and Semiconductor Substrate Container Arrangement**. This method focuses on creating a photoresist layer over a semiconductor substrate, which is then selectively exposed to actinic radiation. Following exposure, the semiconductor substrate is stored in a container under an atmosphere of extremely dry clean air or inert gas, ensuring the integrity of the photoresist layer remains intact.

Career Highlights

Chun-Wei Liao has worked with some of the leading institutions in the field, including Taiwan Semiconductor Manufacturing Company Ltd. and National Tsing Hua University. His professional journey reflects a commitment to advancing semiconductor technologies and processes.

Collaborations

Throughout his career, Chun-Wei Liao has collaborated with esteemed colleagues, including Hui-Chun Lee and Tung-Hung Feng. These partnerships have played a vital role in his research and development efforts, contributing to the successful realization of his patented inventions.

Conclusion

Chun-Wei Liao's innovative spirit and dedication to the semiconductor industry position him as a leading figure among inventors in this field. His patents not only showcase his expertise but also promise to drive advancements in semiconductor manufacturing techniques for years to come.