Chun-Hung Peng

Title: Innovations of Chun-Hung Peng

Introduction

Chun-Hung Peng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on methods for forming via holes, which are crucial in the manufacturing of semiconductor devices.

Latest Patents

Chun-Hung Peng's latest patents include a method of forming self-aligned unlanded via holes. This invention discloses a process that begins with providing a substrate with a patterned conductive layer. A first dielectric layer is then deposited using high-density plasma chemical vapor deposition (HDP CVD). Following this, a silicon nitride layer and a second dielectric layer are sequentially deposited. The process continues with etching back these layers to remove a portion of the silicon nitride layer over the patterned conductive layer. Finally, a third dielectric layer is deposited, and via holes are defined within it.

Another significant patent is a method for forming a plurality of self-aligned via holes applied to semiconductor devices. This method involves several steps, including providing a substrate with a conducting layer and a sacrificial layer. The sacrificial layer is partially removed while retaining pillars, and portions of the conducting layer beneath are also removed. A first insulating layer is then formed and planarized to expose the tops of the sacrificial pillars. The final step involves removing the pillars while retaining the insulating layer, resulting in self-aligned via holes that require less photolithography equipment.

Career Highlights

Chun-Hung Peng has worked with prominent companies in the semiconductor industry, including United Microelectronics Corporation and Holtek Microelectronics Inc. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Chun-Hung Peng has collaborated with notable colleagues such as Hua-Shu Ivan Wu and Hung-Chan Lin. These collaborations have likely enhanced his research and development efforts in the field.

Conclusion

Chun-Hung Peng's contributions to semiconductor technology through his innovative patents demonstrate his expertise and impact in the industry. His methods for forming via holes are essential for advancing semiconductor manufacturing processes.