Company Filing History:
14 out of 1,874 
1 out of 832,880 Years Active: 2001-2004
Title: Innovations of Chun Hung Lin
Introduction
Chun Hung Lin is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 15 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor chip packages.
Latest Patents
One of his latest patents is titled "Low-pin-count chip package having concave die pad and/or connections pads." This invention features a low-pin-count chip package that includes a die pad for receiving a semiconductor chip and multiple connection pads that are electrically coupled to the chip. The unique aspect of this design is that both the die pad and the connection pads have a concave profile. The package body is formed over the semiconductor chip, die pad, and connection pads, allowing portions of these components to extend outward from the bottom of the package body. Additionally, he has developed a patent for a "Semiconductor chip package and manufacturing method thereof." This invention comprises a lead frame, a semiconductor die, and a plastic package body, with a design that ensures the semiconductor die is securely encapsulated while maintaining accessibility to critical components.
Career Highlights
Chun Hung Lin has worked with Advanced Semiconductor Engineering, Inc., where he has contributed to various projects that focus on semiconductor technology. His expertise in this field has allowed him to develop innovative solutions that address industry challenges.
Collaborations
Throughout his career, Chun Hung Lin has collaborated with notable colleagues, including Su Tao and Kuang-Hui Chen. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in semiconductor packaging.
Conclusion
Chun Hung Lin's contributions to semiconductor packaging through his innovative patents and collaborations highlight his significant role in advancing technology in this field. His work continues to influence the industry and pave the way for future innovations.