The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Jul. 06, 2000
Chun Hung Lin, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
A method of making a chip scale package comprises the following steps: providing a semiconductor chip having a plurality of metal bumps formed on the active surface thereof; providing a metal plate having a plurality of flip-chip pads formed on a surface thereof; positioning the semiconductor chip on the surface of the metal plate with the metal bumps on the chip aligned with the flip-chip pads on the metal plate; connecting the metal bumps on the active surface of the semiconductor chip to the flip-chip pads on the surface of the metal plate; encapsulating the semiconductor chip against a portion of the surface of the metal plate; removing the metal plate while leaving the flip-chip pads intact; and forming a plurality of solder balls on the flip-chip pads. Using the technique of the present invention, it becomes possible that the manufacture of a molded chip scale package can be relatively simplified and economical, yet highly reliable.