The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
May. 02, 2000
Chun Hung Lin, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohshiung, TW;
Abstract
A method of molding a semiconductor device comprising the steps of: (a) providing a molding die comprising a molding portion having a cavity for accepting the semiconductor device, a dummy cavity connected to the cavity and an air vent connected to the dummy cavity; (b) closing and clamping the molding die in a manner that the semiconductor chip is positioned in the cavity; (c) transferring a molding material into the cavity and the dummy cavity; (d) hardening the molding material; (e) unclamping and opening the molding die to take out the molded product. The molding method of the present invention is characterized in that even though the cavity with the semiconductor device positioned therein is filled, the transfer ram keeps moving such that the molding material is forced to continue flowing into the dummy cavity. This invention further provides a molding die for use in molding a semiconductor device. The molding die mainly comprises a pot for storing molding material, a molding portion and a runner. The molding portion has a cavity for accepting the semiconductor device, a dummy cavity connected to the cavity and an air vent connected to the dummy cavity. The runner has one end connected to the pot and the other end connected to the cavity through a gate. The channel for connecting the cavity to the dummy cavity has a size substantially the same as the size of the gate such that during molding, the molding material will fill the cavity through the runner and the gate, and then fill the dummy cavity through the channel.