The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Nov. 22, 1999
Chun Hung Lin, Kaohsiung, TW;
Yire Zine Lee, Kaohsiung Hsien, TW;
Su Tao, Kaohsiung, TW;
Jian Wen Chen, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
This invention moves at least one outer via outwardly to a location under the edge of the chip so as to form an offset via. Since the via is made of copper, the offset via provides sufficient supporting strength for the chip edge during molding process. Further, this invention also disposes a copper mesh on the substrate at the area without vias and traces so as to enhance the substrate strength for supporting the chip. According to another aspect of this invention, dummy via holes are provided for the substrate at the area under the chip edge for supporting the chip. Since the copper mesh, offset via, the dummy via hole are made of copper having sufficient supporting strength for the chip, the crack problem during molding process can be eliminated.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile