Company Filing History:
Years Active: 2001
Title: Yire Zine Lee: Innovating Semiconductor Packaging Solutions
Introduction
Yire Zine Lee is a distinguished inventor based in Kaohsiung Hsien, Taiwan, known for his innovative contributions to the field of semiconductor packaging. With one patent to his name, Yire has made a significant impact on improving the durability and reliability of semiconductor technology.
Latest Patents
Yire Zine Lee holds a patent for a "Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking." This inventive solution involves relocating at least one outer via outwardly to a location beneath the chip's edge, thereby creating an offset via. The use of copper for the offset via provides the necessary support to prevent cracking during the molding process. Additionally, the invention incorporates a copper mesh placed on the substrate in areas without vias and traces, further enhancing the substrate's strength. To bolster support, dummy via holes are included in the substrate area under the chip edge. This innovative design effectively eliminates cracking issues during the molding process.
Career Highlights
Yire Zine Lee is associated with Advanced Semiconductor Engineering, Inc., where he continues to contribute to advancements in semiconductor technologies. His work exemplifies the intersection of innovation and practical applications in the highly competitive field of electronics.
Collaborations
At Advanced Semiconductor Engineering, Yire collaborates with other talented professionals, including Chun Hung Lin and Su Tao, who contribute their expertise and knowledge to drive innovation in semiconductor packaging solutions. Working alongside such skilled colleagues enhances the collaborative spirit necessary in research and development.
Conclusion
Yire Zine Lee's innovative approach to semiconductor packaging, particularly through his patented inventions, showcases the importance of creativity and engineering in advancing technology. His contributions are set to shape the future of semiconductor reliability, ensuring that designs are well-equipped to meet the demands of modern electronic applications.