Kaohsiung, Taiwan

Chun-Hung Cheng

This inventor holds 26 USPTO granted patents and 3 published patent applications and 2 EPO patents, primarily in Resistive Memory Technology. Top assignee: United Microelectronics Corp.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Hung Cheng. Retrieved from https://idiyas.com/inventor/chun-hung-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
RRAM Structure
Fabrication Method
Resistive Memory Device
Semiconductor Device
Variable Resistance
Hard Mask Layers
Memory Device Structure
Shallow Trench Isolation
26 patents (USPTO):Explore Patents

Title: Chun-Hung Cheng: Innovator from Kaohsiung

Introduction: Chun-Hung Cheng is a renowned inventor hailing from Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chun-Hung Cheng holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Cheng has worked with leading tech companies, research institutions, and universities, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Chun-Hung Cheng has collaborated with top inventors, patent attorneys, and companies worldwide, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Chun-Hung Cheng's passion for innovation, coupled with his technical expertise and collaborative spirit, continues to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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