The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

May. 23, 2022
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Wen-Jen Wang, Tainan, TW;

Chun-Hung Cheng, Kaohsiung, TW;

Chuan-Fu Wang, Miaoli County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 70/00 (2023.01); H10D 1/47 (2025.01);
U.S. Cl.
CPC ...
H10N 70/841 (2023.02); H10D 1/474 (2025.01); H10N 70/8833 (2023.02); H10N 70/023 (2023.02); H10N 70/026 (2023.02);
Abstract

Provided is a resistive memory structure and a manufacturing method thereof. The resistive memory structure includes a substrate, a dielectric layer, a resistive memory device, a hard mask layer, and a spacer. The dielectric layer is located on the substrate. The dielectric layer has an opening. The resistive memory device is located in the opening and has a protrusion outside the opening. The resistive memory device includes a first electrode, a variable resistance layer, and a second electrode. The variable resistance layer is located on the first electrode. The second electrode is located on the variable resistance layer. The hard mask layer covers a top surface of the variable resistance layer. The spacer covers a sidewall of the variable resistance layer in the protrusion.


Find Patent Forward Citations

Loading…