Taichung, Taiwan

Chun Chieh Lin

This inventor holds 3 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun Chieh Lin. Retrieved from https://idiyas.com/inventor/chun-chieh-lin-3mtihu6j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 102(Granted Patents)


Company Filing History:


Years Active: 2004-2015

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3 patents (USPTO):Explore Patents

Title: Chun Chieh Lin: Pioneering Female Inventor from Taichung

Introduction: Chun Chieh Lin is a trailblazing inventor hailing from Taichung, Taiwan. Her innovative spirit and dedication to creating impactful solutions have solidified her as a prominent figure in the world of inventions.

Latest Patents: Chun Chieh Lin holds several patents in the field of sustainable packaging solutions, including a groundbreaking design for biodegradable food containers and eco-friendly packaging materials.

Career Highlights: Throughout her illustrious career, Chun Chieh Lin has been recognized for her contributions to environmental sustainability through her inventions. Her work has not only revolutionized the packaging industry but has also set new standards for eco-conscious innovation.

Collaborations: Chun Chieh Lin has collaborated with various research institutions and universities to further develop her inventions and bring them to market. Her partnerships have been instrumental in advancing the reach and impact of her groundbreaking ideas.

Conclusion: Chun Chieh Lin's dedication to innovation and sustainability serves as an inspiration to aspiring inventors worldwide. Her pioneering work continues to shape the future of eco-friendly solutions, making her a true visionary in the field of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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