Chu-Chun Hsieh

Title: The Innovations of Chu-Chun Hsieh

Introduction

Chu-Chun Hsieh is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on methods that enhance the performance and efficiency of semiconductor devices, particularly in flash memory applications.

Latest Patents

One of his latest patents is a method for forming a semiconductor device that includes flash memory. This innovative method involves providing a semiconductor substrate with multiple floating gates and an isolation structure between them. The process includes a series of etching and ion implantation steps that ultimately create a tapered profile in the semiconductor structure. Another notable patent is a double-patterning method designed to improve sidewall uniformity. This method includes forming a doped polysilicon layer, a core layer, and an undoped polysilicon layer, followed by a series of etching and atomic layer deposition processes to achieve precise patterns.

Career Highlights

Chu-Chun Hsieh is currently employed at Winbond Electronics Corporation, a leading company in the semiconductor industry. His work at Winbond has allowed him to apply his innovative ideas and contribute to the advancement of semiconductor technologies.

Collaborations

He has collaborated with notable coworkers such as Tse-Mian Kuo and Ting-Wei Wu, further enhancing the innovative environment at Winbond Electronics Corporation.

Conclusion

Chu-Chun Hsieh's contributions to semiconductor technology through his patents and work at Winbond Electronics Corporation highlight his role as a key innovator in the field. His methods for improving semiconductor devices continue to influence the industry positively.