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For the Inventor, By the Inventor

Livermore, CA, United States of America

Christopher Paul Wyland

This inventor holds 10 USPTO granted patents and 1 published patent application and 5 EPO patents. Top assignees: Juniper Networks, Inc., Xilinx, Inc., Nxp B.v.. Active years: 2012-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christopher Paul Wyland. Retrieved from https://idiyas.com/inventor/christopher-paul-wyland

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.7

ph-index = 5

Forward Citations = 94(Granted Patents)


Company Filing History:

goldMedal4 out of 4,776 
 
Juniper Networks, Inc.
 patents
silverMedal4 out of 5,108 
 
Xilinx, Inc.
 patents
bronzeMedal1 out of 5,325 
 
Nxp B.v.
 patents
4. 1 out of 42 
 
Openlight Photonics, Inc.
 patents

Years Active: 2012-2024

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10 patents (USPTO):Explore Patents
1. 11937368 - Structure for circuit interconnects (2024-03-19),
2. 11653477 - Thermal management with variable conductance heat pipe (2023-05-16),
3. 11051431 - Thermal management with variable conductance heat pipe (2021-06-29),
4. 10999923 - Structure for circuit interconnects (2021-05-04),
5. 10292307 - Thermal heatsink (2019-05-14),
6. 9377802 - Dynamic configuration of equivalent series resistance (2016-06-28),
7. 9337138 - Capacitors within an interposer coupled to supply and ground planes of a substrate (2016-05-10),
8. 8680677 - Carbon nanotube-based conductive connections for integrated circuit devices (2014-03-25),
9. 8410579 - Power distribution network (2013-04-02),
10. 8143976 - High impedance electrical connection via (2012-03-27),

Title: Christopher Paul Wyland: Innovator in Circuit Interconnects and Thermal Management

Introduction

Christopher Paul Wyland is a notable inventor based in Livermore, California. He holds a total of 10 patents, showcasing his significant contributions to the fields of circuit interconnects and thermal management technologies. His innovative work has had a profound impact on high-speed signal processing and integrated circuit cooling solutions.

Latest Patents

Wyland's latest patents include a structure for circuit interconnects, which describes various configurations of high-speed via structures. These embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by utilizing impedance compensation structures that decrease mismatches in circuit components. Additionally, he has developed a thermal management system using variable conductance heat pipes. This technology allows photonic and electronic integrated circuits to be effectively cooled by incorporating a non-condensable gas along with a phase-changing working fluid.

Career Highlights

Throughout his career, Wyland has worked with prominent companies such as Xilinx, Inc. and Juniper Networks, Inc. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the industry.

Collaborations

Wyland has collaborated with talented individuals, including coworkers Paul Y Wu and Romi Mayder. These partnerships have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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