The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Apr. 26, 2018
Applicant:
Juniper Networks, Inc., Sunnyvale, CA (US);
Inventor:
Christopher Paul Wyland, Livermore, CA (US);
Assignee:
Juniper Networks, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 3/46 (2013.01); H05K 2201/0776 (2013.01); H05K 2201/093 (2013.01);
Abstract
Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.
Wyland, Christopher. (2021). Structure for circuit interconnects (U.S. Patent No. 10999923). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10999923
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile