Xilinx, Inc.

Juniper Networks, Inc.

Nxp B.v.

Openlight Photonics, Inc.

Christopher Paul Wyland

Paul Y Wu

Gregory Alan Fish

Brian Robert Koch

Theodore John Schmidt

Roberto Marcoccia

Romi Mayder

Robert Silvio Guzzon

Atul V Ghia

Henley Liu

Paul T Sasaki

Jian Tan

Ketan Sodha

Khaldoon S Abugharbieh

Sanjiv Stokes

Yong Wang

Gregory Meredith

Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.

Structure for circuit interconnects

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

Thermal management with variable conductance heat pipe

An example heatsink is operable as a multimode thermal switching heatsink and includes a housing that has a first heat transfer coefficient. The housing has a first heat transfer coefficient. The heatsink further includes a liquid in thermal communication with the housing and operatively positioned adjacent to a heat source. The liquid has a second heat transfer coefficient, which may be greater than the first heat transfer coefficient. In a first operating condition, the liquid has a first volume at a first thermal contact with the heat source, and, in a second operating condition, the liquid has a second volume and a second thermal contact with the heat source. The second thermal contact is greater than the first thermal contact, thereby enhancing dissipation of heat from the heat source in the second operating condition.

Thermal heatsink

In one embodiment, an integrated circuit (IC) includes a power distribution network having a first set of power distribution lines connected to a source voltage and a second set of power distribution lines connected to a ground voltage, and a first capacitor. A first variable resistive element is electrically coupled in series with the first capacitor between the first and second sets of power lines of the power distribution network. A control circuit is coupled to the variable resistive element and is configured and arranged to adjust a level of resistance of the first variable resistive element in response to an input signal. The adjustment of the level of resistance adjusts an equivalent series resistance of the power distribution network.

Dynamic configuration of equivalent series resistance

An embodiment of an apparatus to reduce supply voltage noise with capacitors of an interposer of a stacked die is disclosed. In this embodiment, an interposer is coupled to a first integrated circuit die using a first plurality of interconnects. A substrate is coupled to the interposer using a second plurality of interconnects. The substrate includes a supply voltage plane and a ground plane, each of which is coupled to the first integrated circuit die using the second plurality of interconnects, the interposer, and the first plurality of interconnects. The interposer includes capacitors coupled in parallel using the supply voltage plane, the ground plane, and the second plurality of interconnects, where capacitance from capacitors of the interposer is provided to the first integrated circuit die using the supply voltage plane and the ground plane of the substrate.

Capacitors within an interposer coupled to supply and ground planes of a substrate

Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material () is associated with another material () such as a metal. The carbon nanotube material facilitates the electrical connection between different circuit components.

Carbon nanotube-based conductive connections for integrated circuit devices

In one embodiment, an integrated circuit (IC) is presented. The IC includes first and second sets of power distribution lines formed in the IC. The IC includes first and second capacitors formed in one or more layers of the IC. A first plurality of vias couple a first input of the first and second capacitors to the first set of power distribution lines, and a second plurality of vias couple a second input of the first and second capacitors to the second set of power distribution lines. The first capacitor and the first plurality of vias and the second plurality of vias coupled thereto having an equivalent series resistance greater than an equivalent series resistance of the second capacitor and the first plurality of vias and the second plurality of vias coupled thereto.

Power distribution network

Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.

Growing community of inventors

Livermore, CA, United States of America

Christopher Paul Wyland