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For the Inventor, By the Inventor

West Linn, OR, United States of America

Chong J Zhao

This inventor holds 12 USPTO granted patents and 7 published patent applications. Top assignees: Intel Corporation, Tahoe Research, Ltd.. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chong J Zhao. Retrieved from https://idiyas.com/inventor/chong-j-zhao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 91.7

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 22(Granted Patents)


Company Filing History:

goldMedal9 out of 56,290 
 
Intel Corporation
 patents
silverMedal3 out of 85 
 
Tahoe Research, Ltd.
 patents

Years Active: 2017-2025

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12 patents (USPTO):Explore Patents
1. 12340863 - Stacked memory chip solution with reduced package inputs/outputs (I/Os) (2025-06-24),
2. 12087352 - Techniques to couple high bandwidth memory device on silicon substrate and package substrate (2024-09-10),
3. 12073906 - Package pin pattern for device-to-device connection (2024-08-27),
4. 11776619 - Techniques to couple high bandwidth memory device on silicon substrate and package substrate (2023-10-03),
5. 11621237 - Interposer and electronic package (2023-04-04),
6. 11569161 - Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds (2023-01-31),
7. 11557333 - Techniques to couple high bandwidth memory device on silicon substrate and package substrate (2023-01-17),
8. 11056179 - Techniques to couple high bandwidth memory device on silicon substrate and package substrate (2021-07-06),
9. 10884958 - DIMM for a high bandwidth memory channel (2021-01-05),
10. 10592445 - Techniques to access or operate a dual in-line memory module via multiple data channels (2020-03-17),
11. 10146711 - Techniques to access or operate a dual in-line memory module via multiple data channels (2018-12-04),
12. 9832876 - CPU package substrates with removable memory mechanical interfaces (2017-11-28),

Title: The Inventor Profile of Chong J Zhao

Introduction: Chong J Zhao, a talented inventor hailing from West Linn, Oregon, has made significant contributions to the field of innovations with his groundbreaking ideas and inventions.

Latest Patents: Chong J Zhao holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: Throughout his illustrious career, Chong J Zhao has worked with leading research institutions and companies, where he has been instrumental in developing cutting-edge technologies that have had a lasting impact on the industry.

Collaborations: Chong J Zhao has collaborated with top inventors, patent attorneys, and research institutions, fostering a culture of innovation and knowledge sharing that has led to the creation of revolutionary products and services.

Conclusion: In conclusion, Chong J Zhao's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventions, inspiring future generations to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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