The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Dec. 18, 2014
Intel Corporation, Santa Clara, CA (US);
Mani Prakash, University Place, WA (US);
Thomas T. Holden, Olympia, WA (US);
Jeffory L. Smalley, East Olympia, WA (US);
Ram S. Viswanath, Phoenix, AZ (US);
Bassam N. Coury, Dupont, WA (US);
Dimitrios Ziakas, Hillsboro, OR (US);
Chong J. Zhao, West Linn, OR (US);
Jonathan W. Thibado, Beaverton, OR (US);
Gregorio R. Murtagian, Phoenix, AZ (US);
Kuang C. Liu, Queen Creek, AZ (US);
Rajasekaran Swaminathan, Tempe, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
John M. Lynch, Forest Grove, OR (US);
David J. Llapitan, Tacoma, WA (US);
Sanka Ganesan, Chandler, AZ (US);
Xiang Li, Portland, OR (US);
George Vergis, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.