This inventor holds 3 USPTO granted patents. Top assignee: United Microelectronics Corp.. Active years: 2006-2008.
Location History:
- Tao-Yuan Hsien, TW (2006)
- Taoyuan County, TW (2008)
Company Filing History:
Years Active: 2006-2008
Title: Innovations of Ching-Wen Teng
Introduction
Ching-Wen Teng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in polishing processes. With a total of 3 patents to his name, Teng's work has advanced the efficiency and effectiveness of wafer processing.
Latest Patents
One of Teng's latest patents is a method for controlling the polishing process. This invention involves providing a first wafer with a thin film and obtaining a film average thickness distribution by measuring thickness values across various regions of the wafer. A removal rate recipe is then determined based on this distribution, allowing for a more controlled polishing process. Another significant patent is the wafer carrier gap washer, which includes a wafer carrier head with a flexible membrane and a retaining ring. This design allows for effective cleaning of the gap between the membrane and the retaining ring during the chemical mechanical polishing (CMP) process, ensuring the removal of slurry residues.
Career Highlights
Ching-Wen Teng is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work there focuses on improving wafer processing techniques, which are crucial for the production of high-quality semiconductor devices.
Collaborations
Teng has collaborated with several talented individuals in his field, including Chin-Kun Lin and Ming-Hsing Kao. These collaborations have fostered innovation and have contributed to the successful development of his patented technologies.
Conclusion
Ching-Wen Teng's contributions to the semiconductor industry through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the efficiency of wafer processing, making a significant impact in the field.