The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
May. 26, 2005
Applicants:
Ching-wen Teng, Tao-Yuan Hsien, TW;
Ming-hsing Kao, Tai-Tung Hsien, TW;
Chin-kun Lin, Kao-Hsiung, TW;
Er-yang Chua, Singapore, SG;
Lee-lee Lau, Melaka, MY;
Inventors:
Ching-Wen Teng, Tao-Yuan Hsien, TW;
Ming-Hsing Kao, Tai-Tung Hsien, TW;
Chin-Kun Lin, Kao-Hsiung, TW;
Er-Yang Chua, Singapore, SG;
Lee-Lee Lau, Melaka, MY;
Assignee:
United Microelectronics Corp., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for chemical mechanical polishing (CMP) includes a rinsing process performed to clean an orifice of a slurry supplier and other elements of a CMP device. The CMP device includes least one nozzle disposed in the periphery of a base. The function of the nozzle is to spray DI water to the orifice of the slurry supplier so as to prevent slurry residue and clogging.