Lee-Lee Lau

Title: Innovations of Lee-Lee Lau in Chemical Mechanical Polishing

Introduction

Lee-Lee Lau is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of chemical mechanical polishing, with a total of 3 patents to his name. His work is particularly relevant in the semiconductor industry, where precision and efficiency are paramount.

Latest Patents

Lee-Lee Lau's latest patents focus on advanced chemical mechanical polishing processes. One of his patents describes a method that involves placing a substrate on a first polishing pad of a first platen. This substrate contains a bulk metal layer and a barrier layer. The process includes polishing the bulk metal layer using a first polishing pad with a hardness above 50 (Shore D) until the barrier layer is exposed. Following this, the barrier layer is polished on a second polishing pad of a second platen, which has a hardness ranging between 40 and 50 (Shore D). This second pad consists of an upper layer and a lower backing layer, with the upper layer having a hardness less than 50 (Shore D).

Another patent outlines a copper/barrier CMP process. This process begins with providing a substrate that has both a bulk metal layer and a barrier layer. The substrate is polished with a first hard polishing pad on a first platen to substantially remove the upper portion of the bulk metal layer. The first hard polishing pad also has a hardness above 50 (Shore D). Subsequently, the substrate is polished with a second hard polishing pad on a second platen to remove residual copper, exposing the barrier layer. Finally, a third hard polishing pad is used on a third platen to remove the barrier layer, with this pad having a hardness ranging between 40-50 (Shore D).

Career Highlights

Lee-Lee Lau is currently employed at United Microelectronics Corporation, where he continues to innovate in the field of semiconductor manufacturing. His expertise in chemical mechanical polishing has made him a valuable asset to the company.

Collaborations

Throughout his career, Lee-Lee has collaborated with several talented individuals, including Chin-Kun Lin and Boon-Tiong Neo. These collaborations have further enhanced his work and contributed to the advancements in chemical mechanical polishing techniques.

Conclusion

Lee-Lee Lau's contributions to the field of chemical mechanical polishing are noteworthy and impactful. His innovative patents and ongoing