Company Filing History:
Years Active: 2004-2014
Title: Innovations of Chin-Kun Lin in Chemical Mechanical Polishing
Introduction
Chin-Kun Lin is a notable inventor based in Kao-Hsiung, Taiwan. He has made significant contributions to the field of chemical mechanical polishing, holding a total of six patents. His work has advanced the processes used in semiconductor manufacturing, showcasing his expertise and innovative spirit.
Latest Patents
Chin-Kun Lin's latest patents include a chemical mechanical polishing process that involves placing a substrate on a first polishing pad of a first platen. This process polishes the bulk metal layer until the barrier layer is exposed. Another patent details a copper/barrier CMP process, which includes several steps to effectively remove the bulk metal layer and the barrier layer using polishing pads of varying hardness. These innovations reflect his commitment to improving efficiency and effectiveness in semiconductor fabrication.
Career Highlights
Throughout his career, Chin-Kun Lin has worked with prominent companies such as United Microelectronics Corporation and United Microelectric Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in the industry.
Collaborations
Chin-Kun Lin has collaborated with notable colleagues, including Ming-Hsing Kao and Ching-Wen Teng. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Chin-Kun Lin's contributions to chemical mechanical polishing have established him as a key figure in the semiconductor industry. His patents and collaborations highlight his dedication to innovation and excellence in his field.