Ching-Wei Chen

Title: Innovations of Ching-Wei Chen in Wafer Dicing Technology

Introduction

Ching-Wei Chen is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer dicing methods. With a total of 14 patents to his name, Chen's work has advanced the efficiency and precision of semiconductor manufacturing processes.

Latest Patents

Among his latest patents, Chen has developed a method of wafer dicing that includes a comprehensive process for separating dies from a wafer. This method involves providing a wafer with multiple die regions and a scribe region. The process includes a first removal step to eliminate a test structure and dielectric layer, exposing the substrate. Following this, a second removal process is executed to separate the dies. Another notable patent focuses on a similar wafer dicing method, detailing the steps of removing portions of the scribe line structure and attaching the wafer with tapes to facilitate the dicing process.

Career Highlights

Ching-Wei Chen has worked with notable companies in the industry, including Pixart Imaging Incorporated and Au Optronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in semiconductor technology.

Collaborations

Chen has collaborated with talented individuals in his field, including En-Feng Hsu and Chih-Cheng Hsieh. These collaborations have fostered a creative environment that has led to the development of cutting-edge technologies.

Conclusion

Ching-Wei Chen's contributions to wafer dicing technology exemplify his innovative spirit and dedication to advancing semiconductor manufacturing. His patents reflect a deep understanding of the complexities involved in the process, making him a key figure in the industry.