Ching-Kun Huang

Title: **Ching-Kun Huang: Innovating Semiconductor Technology**

Introduction

Ching-Kun Huang, based in Jhubei, Taiwan, is a prominent inventor recognized for his contributions to semiconductor technology. With a total of 9 patents to his name, Huang has made significant advancements in the field, particularly through his innovative designs and manufacturing methods.

Latest Patents

One of Huang's latest patents involves a semiconductor structure and its manufacturing method. This semiconductor structure consists of a first dielectric layer, a first conductive via, and a partial landing pad. The design also incorporates a second dielectric layer and a second conductive via. Notably, the first conductive via is embedded within the first dielectric layer, while the partial landing pad is strategically placed on top of the first conductive via and the first dielectric layer. The unique aspect of this design is that the top surface of the partial landing pad is wider than or equal to the bottom surface, enhancing its structural integrity. The second dielectric layer is layered over the partial landing pad, with the second conductive via established within the second dielectric layer, ensuring electrical connection with the partial landing pad.

Career Highlights

Huang has spent a significant portion of his career at Taiwan Semiconductor Manufacturing Company Limited, where much of his innovative work takes place. His expertise in semiconductor technology and dedication to research are evident through the patents he has secured, reflecting his role as a leading figure in the industry.

Collaborations

Throughout his career, Huang has collaborated with talented professionals like Song-Bor Lee and Cheng-Chien Li. These partnerships have facilitated the development and refinement of innovative semiconductor solutions, further advancing the frontiers of technology in their field.

Conclusion

Ching-Kun Huang continues to be an influential inventor in semiconductor technology, with a solid patent portfolio that underscores his commitment to innovation. His recent works demonstrate a keen understanding of complex semiconductor structures and manufacturing methods, positioning him as a key player in shaping future technological advancements.