Zhunan, Taiwan

Chin-Ming Lin

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Ming Lin. Retrieved from https://idiyas.com/inventor/chin-ming-lin-glk7qmdk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 83.3

Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Jhunan Township, Miaoli County, TW (2014)
  • Jhunan Township, TW (2012 - 2018)

Company Filing History:


Years Active: 2012-2025

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6 patents (USPTO):Explore Patents

Title: Innovations of Chin-Ming Lin

Introduction

Chin-Ming Lin is a prominent inventor based in Jhunan, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 6 patents. His work focuses on improving processes that enhance the efficiency and yield of semiconductor production.

Latest Patents

One of his latest patents is titled "Wet bench process with in-situ pre-treatment operation." This invention relates to a wet bench processing method that includes an in-situ pre-treatment prior to performing the first set of wet bench operations. The pre-treatment may consist of a pre-clean operation and/or a pre-heat operation. This process can be performed in existing ONB tanks without the need for adding new tanks to an existing wet bench tool. The pre-clean operation effectively removes particles from a batch of wafers, thereby reducing cross-contamination and defect issues, which ultimately improves the yield rate of the wet bench process. Additionally, the pre-heat operation provides better control and stabilizes the temperature in the CHB tank, ensuring a consistent etch rate.

Another notable patent is for "Selective solder bump formation on wafer." This method involves performing a wafer test to identify known good dies (KGDs) on the wafer. Solder bumps are then formed on these KGDs, enhancing the efficiency of the manufacturing process.

Career Highlights

Chin-Ming Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative approaches and patented technologies have contributed to advancements in semiconductor manufacturing processes.

Collaborations

He has collaborated with notable coworkers such as Chi-Ming Yang and Chia-Hung Huang, further enhancing the innovative capabilities within his team.

Conclusion

Chin-Ming Lin's contributions to semiconductor manufacturing through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence the efficiency and effectiveness of semiconductor production processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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