The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Sep. 24, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chin-Ming Lin, Jhunan Township, TW;

Wan-Lai Chen, Hsinchu, TW;

Chia-Hung Huang, Hsinchu, TW;

Chi-Ming Yang, Hsinchu, TW;

Chin-Hsiang Lin, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/68 (2006.01); H01L 21/268 (2006.01); H01L 23/544 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); H01L 21/268 (2013.01); H01L 21/67282 (2013.01); H01L 21/683 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54493 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A system for orienting a semiconductor wafer. The system includes a wafer retaining device configured to retain a semiconductor wafer, a light source configured to emit light toward an edge exclusion area of the wafer, and a lens configured to direct and focus light emitted from the light source at a subsurface first part of a first portion of the wafer to alter a crystalline structure of the subsurface first part and form a subsurface mark that is detectable using light of a predetermined wavelength, a predetermined transmittance through the wafer, and at a predetermined reflectance angle relative to an axis of rotation of the wafer and based on the predetermined wavelength.


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