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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chin-Lung Chung

This inventor holds 13 USPTO granted patents and 13 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Lung Chung. Retrieved from https://idiyas.com/inventor/chin-lung-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 84.6

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Hsinchu, TW (2021 - 2024)
  • Taoyuan, TW (2024)

Company Filing History:

goldMedal13 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2021-2026

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13 patents (USPTO):Explore Patents
1. 12751258 - Semiconductor structure and manufacturing method thereof (2026-09-29),
2. 12690433 - Low resistance interconnect features and method for manufacturing the same (2026-07-21),
3. 12660580 - Selective barrier layer deposition using blocking layers (2026-06-16),
4. 12648419 - Semiconductor structure having vertical conductive graphene and method for forming the same (2026-06-02),
5. 12347776 - Integrated chip with graphene based interconnect (2025-07-01),
6. 12300599 - Method for forming semiconductor structure (2025-05-13),
7. 12218060 - Integrated chip with graphene based interconnect (2025-02-04),
8. 12051643 - Hybrid via interconnect structure (2024-07-30),
9. 11978663 - Integrated circuit interconnect structure having discontinuous barrier layer and air gap (2024-05-07),
10. 11948837 - Semiconductor structure having vertical conductive graphene and method for forming the same (2024-04-02),
11. 11682616 - Semiconductor structure and method for forming the same (2023-06-20),
12. 11605558 - Integrated circuit interconnect structure having discontinuous barrier layer and air gap (2023-03-14),
13. 11114374 - Graphene enabled selective barrier layer formation (2021-09-07),

Title: Chin-Lung Chung: Innovator in Semiconductor Technology

Introduction

Chin-Lung Chung is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on integrating advanced materials to enhance the performance of semiconductor devices.

Latest Patents

Chung's latest patents include an innovative integrated chip with graphene-based interconnects. This integrated chip features a substrate with conductive elements separated by a cavity, enhancing electrical performance. Additionally, he has developed a method for forming a semiconductor structure that incorporates a hybrid layered design, which includes both 2D and 3D materials. This method allows for the creation of conductive features and sealed air gaps, improving the efficiency of semiconductor devices.

Career Highlights

Chin-Lung Chung is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor industry. His work has been instrumental in advancing the capabilities of integrated circuits and semiconductor structures.

Collaborations

Chung has collaborated with notable colleagues, including Shin-Yi Yang and Ming-Han Lee, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Chin-Lung Chung's innovative work in semiconductor technology and his numerous patents highlight his role as a key figure in the industry. His contributions continue to shape the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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