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Hsinchu, Taiwan

Chin-Lung Chung

USPTO Granted Patents = 9 (Patent Applications = 13)

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 4(Granted Patents)

Location History:

Hsinchu, TW (2021 - 2024)
Taoyuan, TW (2024)

Company Filing History:

9 out of 40,850

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2021-2025

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12347776 - Integrated chip with graphene based interconnect (2025-07-01),

2. 12300599 - Method for forming semiconductor structure (2025-05-13),

3. 12218060 - Integrated chip with graphene based interconnect (2025-02-04),

4. 12051643 - Hybrid via interconnect structure (2024-07-30),

5. 11978663 - Integrated circuit interconnect structure having discontinuous barrier layer and air gap (2024-05-07),

6. 11948837 - Semiconductor structure having vertical conductive graphene and method for forming the same (2024-04-02),

7. 11682616 - Semiconductor structure and method for forming the same (2023-06-20),

8. 11605558 - Integrated circuit interconnect structure having discontinuous barrier layer and air gap (2023-03-14),

9. 11114374 - Graphene enabled selective barrier layer formation (2021-09-07),

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