Chin Chuan Peng

Title: Innovations by Chin Chuan Peng

Introduction

Chin Chuan Peng is a notable inventor based in Jhudong, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in heat dissipation methods and measurement techniques for interconnections. With a total of 2 patents, his work has implications for improving the efficiency and reliability of electronic devices.

Latest Patents

Chin Chuan Peng's latest patents include a "Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects." This invention presents a semiconductor structure designed to effectively dissipate heat generated from a resistor. The structure comprises a semiconductor substrate, a resistor positioned above it, and a thermal protection structure that includes multiple heat dissipating elements. These elements are strategically placed to ensure efficient heat transfer from the resistor to the semiconductor substrate.

Another significant patent is the "Method for measuring a property of interconnections and structure for the same." This method involves providing a series of interconnection test patterns and forming a pad to which these patterns are connected. By applying current, voltage, or mechanical stress to the pad, the properties of the interconnection test patterns can be accurately measured.

Career Highlights

Chin Chuan Peng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to develop innovative solutions that enhance the performance of semiconductor devices.

Collaborations

Chin Chuan Peng has collaborated with notable colleagues such as Jian-Hong Lin and Chien Shih Tsai. These partnerships have contributed to the advancement of technology in their field.

Conclusion

Chin Chuan Peng's contributions to semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the industry. His work not only addresses current challenges but also paves the way for future developments in electronic device efficiency.