The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2010
Filed:
Sep. 04, 2007
Jian-hong Lin, Yunlin, TW;
Chin Chuan Peng, Jhudong Township, TW;
Shou-chung Lee, Hsinchu, TW;
Chien-jung Wang, Hsin-Chu, TW;
Chien Shih Tsai, Baoshan Township, TW;
Bi-ling Lin, Hsinchu, TW;
Yi-lung Cheng, Danshuei Township, TW;
Jian-Hong Lin, Yunlin, TW;
Chin Chuan Peng, Jhudong Township, TW;
Shou-Chung Lee, Hsinchu, TW;
Chien-Jung Wang, Hsin-Chu, TW;
Chien Shih Tsai, Baoshan Township, TW;
Bi-Ling Lin, Hsinchu, TW;
Yi-Lung Cheng, Danshuei Township, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A method for measuring a property of interconnections is provided. The method includes the following steps. A plurality of interconnection test patterns are provided. A pad to which the plurality of interconnection test patterns are parallelly connected is formed. At least one resistor is formed between at least one of the plurality of interconnection test patterns and the pad. The property of the plurality of interconnection test patterns is measured by applying a current, a voltage and/or a mechanical stress to the pad.