Taiwan Semiconductor Manufacturing Comp. Ltd.

Chin Chuan Peng

Jian-Hong Lin

Bi-Ling Lin

Chien Shih Tsai

Chien-Jung Wang

Yi-Lung Cheng

Tzu-Li Lee

Shou-Chung Lee

Bor-Jou Wei

A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate.

Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects

A method for measuring a property of interconnections is provided. The method includes the following steps. A plurality of interconnection test patterns are provided. A pad to which the plurality of interconnection test patterns are parallelly connected is formed. At least one resistor is formed between at least one of the plurality of interconnection test patterns and the pad. The property of the plurality of interconnection test patterns is measured by applying a current, a voltage and/or a mechanical stress to the pad.

Method for measuring a property of interconnections and structure for the same

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Jhudong, Taiwan

Chin Chuan Peng