The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Jun. 30, 2010
Jian-hong Lin, Huwei Township, TW;
Chin Chuan Peng, Jhudong Township, TW;
Tzu-li Lee, Huwei Township, TW;
Bi-ling Lin, Hsinchu, TW;
Bor-jou Wei, Jiaoxi Township, TW;
Chien Shih Tsai, Baoshan Township, TW;
Jian-Hong Lin, Huwei Township, TW;
Chin Chuan Peng, Jhudong Township, TW;
Tzu-Li Lee, Huwei Township, TW;
Bi-Ling Lin, Hsinchu, TW;
Bor-Jou Wei, Jiaoxi Township, TW;
Chien Shih Tsai, Baoshan Township, TW;
Abstract
A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The semiconductor structure includes a semiconductor substrate, a resistor disposed above the semiconductor substrate, and a thermal protection structure disposed above the resistor. The thermal protection structure has a plurality of heat dissipating elements, the heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate. The thermal protection structure receives the heat generated from the resistor and the heat dissipating elements dissipates the heat to the semiconductor substrate.