Chih-Pin Chiu

Title: Innovations of Chih-Pin Chiu

Introduction

Chih-Pin Chiu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on enhancing semiconductor packaging structures and manufacturing methods.

Latest Patents

Chiu's latest patents include a semiconductor packaging structure and a method for manufacturing the same. This innovative packaging structure features a first passivation layer, a capacitor structure, and a second passivation layer. The capacitor structure is strategically placed on the first passivation layer, while the second passivation layer, which has a compressive stress smaller than −0.3 GPa, is positioned on the capacitor structure opposite to the first passivation layer. Another notable patent is for a wafer test pad, which includes a redistribution structure. This structure comprises a first dielectric layer, a mesh metal feature, a second dielectric layer, and a passivation structure. The redistribution feature is designed to enhance connectivity and efficiency in semiconductor applications.

Career Highlights

Chih-Pin Chiu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging and testing.

Collaborations

Chiu has collaborated with several talented individuals in his field, including Dian-Hau Chen and Chen-Chiu Huang. Their combined expertise contributes to the innovative projects at Taiwan Semiconductor Manufacturing Company Limited.

Conclusion

Chih-Pin Chiu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor packaging and manufacturing methods.