Tainan Hsien, Taiwan

Chih-Jen Mao


Average Co-Inventor Count = 4.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Tainan County, TW (2009 - 2010)
  • Tainan Hsien, TW (2009 - 2012)

Company Filing History:


Years Active: 2009-2012

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5 patents (USPTO):Explore Patents

Title: Chih-Jen Mao: Innovator in Wafer Transfer Technology

Introduction

Chih-Jen Mao is a prominent inventor based in Tainan Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer transfer methods. With a total of 5 patents to his name, Mao's work has had a substantial impact on the efficiency and safety of wafer handling processes.

Latest Patents

One of Mao's latest patents is a method of transferring a wafer. This innovative method involves providing a pedestal with at least one spray orifice extending through it. A wafer is disposed above the pedestal using a first robot, ensuring that the first surface of the wafer faces the pedestal. A fluid is then sprayed onto the first surface simultaneously to prevent contact with the pedestal. This fluid contains a charge-forming chemical substance dissolved within it. The inclusion of this chemical substance helps to avoid discharge damage on the wafer during the spraying process, effectively mitigating the waterfall effect that can occur.

Career Highlights

Chih-Jen Mao is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to further develop his innovative ideas and contribute to advancements in wafer technology.

Collaborations

Mao has collaborated with notable coworkers, including Kuo-Wei Yang and Hui-Shen Shih. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor field.

Conclusion

Chih-Jen Mao's contributions to wafer transfer technology exemplify his dedication to innovation in the semiconductor industry. His patents reflect a commitment to improving processes that enhance the safety and efficiency of wafer handling.

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