Chih-Chieh Hung

Title: Chih-Chieh Hung: Innovator in Integrated Circuit Packaging

Introduction

Chih-Chieh Hung is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit packaging, holding three patents to his name. His work focuses on innovative methods that enhance the efficiency and effectiveness of integrated circuit designs.

Latest Patents

One of Chih-Chieh Hung's latest patents is titled "Integrated circuit package and method of forming same." This invention provides a comprehensive method for creating an integrated circuit package. The process involves attaching an integrated circuit die to a first substrate, forming a dummy die, and attaching it adjacent to the integrated circuit die. An encapsulant is then formed over the first substrate, surrounding both the dummy die and the integrated circuit die. The encapsulant, along with the dies, is planarized to ensure a level surface. Finally, an interior portion of the dummy die is removed, leaving an annular structure that enhances the package's integrity.

Career Highlights

Chih-Chieh Hung is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in integrated circuit packaging has positioned him as a valuable asset to the company. His innovative approaches have contributed to advancements in semiconductor technology.

Collaborations

Chih-Chieh Hung has collaborated with notable colleagues, including Shang-Yun Hou and Sung-Hui Huang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor field.

Conclusion

Chih-Chieh Hung's contributions to integrated circuit packaging exemplify his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving the efficiency of semiconductor designs, making him a significant figure in the industry.