Taiwan Semiconductor Manufacturing Comp. Ltd.

Chih-Chieh Hung

Chen-Hua Douglas Yu

Shang-Yun Hou

Chi-Hsi Wu

Ying-Ching Shih

Hsien-Pin Hu

Hsing-Kuo Hsia

Sung-Hui Huang

Chin-Fu Kao

Kuan-Yu Huang

Li-Chung Kuo

Wen-Hsin Wei

Heh-Chang Huang

Yushun Lin

An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Integrated circuit package and method of forming same

Method of forming a dummy die of an integrated circuit having an embedded annular structure

Growing community of inventors

Hsinchu, Taiwan

Chih-Chieh Hung