The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
May. 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yi-Jung Chen, Yilan County, TW;
Tsung-Fu Tsai, Changhua County, TW;
Szu-Wei Lu, Hsinchu, TW;
Wei-An Tsao, Changhua County, TW;
Che-Yuan Yang, Hsinchu, TW;
Chien-Ting Chen, Taipei, TW;
Chih-Chieh Hung, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure includes an optical die, an optical die, a supporting structure, and a lens structure. The optical die includes a photonic region. The optical die is disposed on and electrically coupled to the optical die. The supporting structure is disposed on the optical die, where the electric die is disposed between the supporting structure and the optical die. The lens structure is disposed on the supporting structure and optically coupled to the photonic region of the optical die, where the supporting structure is disposed between the lens structure and the electric die.