This inventor holds 5 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2020.
Company Filing History:
Years Active: 2013-2020
Title: Chien-Ming Chiu: Innovator in Semiconductor Technology
Introduction
Chien-Ming Chiu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on advanced die stack structures and methods of fabrication, which are crucial for the development of modern electronic devices.
Latest Patents
Chiu's latest patents include innovative designs such as the "Die stack structure and method of fabricating the same." This patent describes a die stack structure that consists of a first die, a dielectric material layer, a first bonding dielectric layer, and a second die. The first die features a through-substrate via (TSV) that protrudes from its rear surface, surrounded by a dielectric material layer. The second die is bonded to the first die through a bonding process involving the TSV. Another notable patent is the "Alignment mark and method of formation," which outlines a structure with a substrate containing a TSV and an isolation layer with a recess for conductive material.
Career Highlights
Chien-Ming Chiu works at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His expertise in die stack structures has positioned him as a key player in advancing semiconductor technology. His patents reflect his commitment to innovation and excellence in this competitive field.
Collaborations
Chiu has collaborated with notable colleagues such as Chen-Hua Douglas Yu and Tsang-Jiuh Wu. Their combined efforts contribute to the ongoing advancements in semiconductor technology.
Conclusion
Chien-Ming Chiu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of electronic devices and semiconductor manufacturing.