This inventor holds 3 USPTO granted patents. Top assignee: Chipbond Technology Corporation. Active years: 2022-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2026
Title: Chia-Hsin Yen: Innovator in Circuit Board Technology
Introduction
Chia-Hsin Yen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 3 patents. His innovative designs focus on enhancing the performance and reliability of circuit boards.
Latest Patents
Chia-Hsin Yen's latest patents include a thin film circuit board and a flexible circuit board. The thin film circuit board features a substrate and a thermal conductive film that includes multiple conductive portions. This design aims to reduce stress and prevent warpage in the circuit board. The flexible circuit board consists of a flexible substrate, a chip, and a patterned circuit layer. It is designed with a working area and a nonworking area, ensuring efficient signal transmission while maintaining structural integrity.
Career Highlights
Chia-Hsin Yen is currently employed at Chipbond Technology Corporation, where he continues to innovate in the field of circuit board technology. His work has been instrumental in advancing the capabilities of electronic components.
Collaborations
Chia-Hsin Yen collaborates with talented coworkers, including Gwo-Shyan Sheu and Yu-Chen Ma, to drive innovation and enhance product development.
Conclusion
Chia-Hsin Yen's contributions to circuit board technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the industry and a dedication to finding effective solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile