The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Jul. 13, 2020
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventors:
Chia-Sung Lin, Taichung, TW;
Huan-Kai Chou, Kaohsiung, TW;
Chia-Hsin Yen, Kaohsiung, TW;
Wen-Fu Chou, Kaohsiung, TW;
Assignee:
Chipbond Technology Corporation, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/02 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 3/305 (2013.01); H05K 13/043 (2013.01);
Abstract
In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.