The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Dec. 19, 2023
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventors:
Kung-Tzu Tu, Kaohsiung, TW;
Gwo-Shyan Sheu, Kaohsiung, TW;
Kuo-Liang Huang, Kaohsiung, TW;
Pei-Wen Wang, Taichung, TW;
Yu-Chen MA, Kaohsiung, TW;
Chia-Hsin Yen, Kaohsiung, TW;
Assignee:
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0209 (2013.01);
Abstract
A thin film circuit board includes a substrate and a thermal conductive film which is adhered to the substrate and includes a first conductive portion, a second conductive portion and a third conductive portion. The thermal conductive film is designed to be polygonal and non-rectangular in order to reduce stress generated in the substrate and the thermal conductive film and protect the thin film circuit board from warpage.