Chipbond Technology Corporation

Chia-Hsin Yen

Hsin-Hao Huang

Gwo-Shyan Sheu

Yu-Chen Ma

Wen-Fu Chou

Chia-Sung Lin

Huan-Kai Chou

A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

Flexible circuit board

In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

Method of attaching heat sinks to a circuit tape

Growing community of inventors

Kaohsiung, Taiwan

Chia-Hsin Yen