Chia-fu Wu

Title: Innovations of Chia-fu Wu in Semiconductor Technology

Introduction

Chia-fu Wu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is for a semiconductor package with an electromagnetic shield. This innovative design includes two substrates and an electromagnetic shield that is strategically placed between them. The shield effectively mitigates electromagnetic interference between adjacent dies, while maintaining the overall vertical height and volume of the package. This design also enhances the heat dissipation efficiency of the semiconductor package.

Another notable patent is for a semiconductor package and its manufacturing method. This package features a lead frame with multiple leads, each containing various conductive parts. The design ensures that the first conductive part is not electrically connected to the second, while the second is connected to the third. The encapsulation process protects the chip and part of the lead frame, allowing for efficient electrical connections and exposure of conductive parts.

Career Highlights

Chia-fu Wu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

Chia-fu Wu collaborates with his coworker, Cheng-Yin Lee, to further enhance their research and development efforts in the semiconductor field.

Conclusion

Chia-fu Wu's contributions to semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the industry. His work not only improves the functionality of semiconductor packages but also sets a foundation for future innovations in the field.