Advanced Semiconductor Engineering, Inc.

Chia-fu Wu

Cheng-Yin Lee

A semiconductor package with an electromagnetic shield is disclosed. The semiconductor package includes two substrates () and an electromagnetic shield (). Each substrate has at least one die () provided thereon. The electromagnetic shield is disposed between the two substrates for shielding electromagnetic interference between adjacent dies of the two substrates. One of the two substrates defines a cavity () for partially accommodating the electromagnetic shield. Accordingly, the overall vertical height and the volume of the semiconductor package are not increased, and the heat dissipation efficiency of the semiconductor package is enhanced.

Semiconductor package with electromagnetic shield

A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part is not electrically connected to the second conductive part, and the second conductive part is electrically connected to the third conductive part. The chip is electrically connected to the first conductive part. The encapsulation encapsulates the chip and at least a portion of the lead frame, and forms a first surface and a second surface opposite to the first surface. The first conductive part and the third conductive part are exposed from the first surface, and the second conductive part is exposed from the second surface.

Semiconductor package and manufacturing method thereof

A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate (), a plurality of semiconductor dies (), a plurality of shielding metal elements (), a plurality of grounding metal elements () and a plurality of conductive metal elements (). The semiconductor dies are disposed on an upper surface () of the substrate along a horizontal direction. The shielding metal elements are provided on the upper surface of the substrate, and are arranged between and around the semiconductor dies so that each semiconductor die is surrounded by the shielding metal elements and thus electromagnetic interference in the horizontal direction can be effectively shielded from each semiconductor die.

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Kaohsiung, Taiwan

Chia-fu Wu