The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Jan. 25, 2008
Chia-fu Wu, Kaohsiung, TW;
Chia-fu Wu, Kaohsiung, TW;
Abstract
A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate (), a plurality of semiconductor dies (), a plurality of shielding metal elements (), a plurality of grounding metal elements () and a plurality of conductive metal elements (). The semiconductor dies are disposed on an upper surface () of the substrate along a horizontal direction. The shielding metal elements are provided on the upper surface of the substrate, and are arranged between and around the semiconductor dies so that each semiconductor die is surrounded by the shielding metal elements and thus electromagnetic interference in the horizontal direction can be effectively shielded from each semiconductor die.