The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Jan. 25, 2008
Chia-fu Wu, Kaohsiung, TW;
Chia-fu Wu, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor package with an electromagnetic shield is disclosed. The semiconductor package includes two substrates () and an electromagnetic shield (). Each substrate has at least one die () provided thereon. The electromagnetic shield is disposed between the two substrates for shielding electromagnetic interference between adjacent dies of the two substrates. One of the two substrates defines a cavity () for partially accommodating the electromagnetic shield. Accordingly, the overall vertical height and the volume of the semiconductor package are not increased, and the heat dissipation efficiency of the semiconductor package is enhanced.