Hsinchu, Taiwan

Chia-Cheng Chang

USPTO Granted Patents = 13 

 

Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2019-2024

Loading Chart...
Loading Chart...
13 patents (USPTO):

Title: Chia-Cheng Chang: Innovator in Semiconductor Packaging

Introduction

Chia-Cheng Chang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 13 patents. His work has been instrumental in advancing technology in this critical area.

Latest Patents

Chang's latest patents include innovative designs for semiconductor package structures. One notable patent describes a semiconductor package structure featuring an annular frame with truncated corners. This design includes a substrate with a wiring structure, where two semiconductor dies are arranged side-by-side and surrounded by a molding material. Another patent outlines a similar semiconductor package structure, emphasizing the arrangement of the semiconductor dies and the incorporation of holes on the substrate's surface.

Career Highlights

Chia-Cheng Chang is currently employed at MediaTek Corporation, a leading company in the semiconductor industry. His expertise in semiconductor packaging has led to numerous advancements and improvements in product design and functionality.

Collaborations

Chang has collaborated with talented coworkers, including Tzu-Hung Lin and I-Hsuan Peng, contributing to the innovative projects at MediaTek Corporation.

Conclusion

Chia-Cheng Chang's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor technologies.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…