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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chia-Cheng Chang

This inventor holds 14 USPTO granted patents and 7 EPO patents, primarily in Semiconductor Packaging. Top assignee: Mediatek Corporation. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Cheng Chang. Retrieved from https://idiyas.com/inventor/chia-cheng-chang-4vrumlo3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 21(Granted Patents)


Company Filing History:

goldMedal14 out of 5,127 
 
Mediatek Corporation
 patents

Years Active: 2019-2026

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Areas of Expertise:
Semiconductor Package Structure
Annular Frame
Lid Structure
Truncated Corners
3D Packaging
Thermal Management
Recess Design
Package Assembly
Interconnects
Chip Design
Integrated Circuits
Manufacturing Techniques
14 patents (USPTO):Explore Patents
1. 12525549 - Semiconductor package structure (2026-01-13),
2. 12142598 - Semiconductor package structure having an annular frame with truncated corners (2024-11-12),
3. 11948895 - Semiconductor package structure (2024-04-02),
4. 11862578 - Semiconductor package structure (2024-01-02),
5. 11688655 - Semiconductor package including lid structure with opening and recess (2023-06-27),
6. 11646295 - Semiconductor package structure having an annular frame with truncated corners (2023-05-09),
7. 11410936 - Semiconductor package structure (2022-08-09),
8. 11264337 - Semiconductor package structure (2022-03-01),
9. 11171113 - Semiconductor package structure having an annular frame with truncated corners (2021-11-09),
10. 10957611 - Semiconductor package including lid structure with opening and recess (2021-03-23),
11. 10903198 - Semiconductor package assembly and method for forming the same (2021-01-26),
12. 10784211 - Semiconductor package structure (2020-09-22),
13. 10497689 - Semiconductor package assembly and method for forming the same (2019-12-03),
14. 10410969 - Semiconductor package assembly (2019-09-10),

Title: Chia-Cheng Chang: Innovator in Semiconductor Packaging

Introduction

Chia-Cheng Chang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 14 patents. His work has been instrumental in advancing technology in this critical area.

Latest Patents

Chang's latest patents include innovative designs for semiconductor package structures. One notable patent describes a semiconductor package structure featuring an annular frame with truncated corners. This design includes a substrate with a wiring structure, where two semiconductor dies are arranged side-by-side and surrounded by a molding material. Another patent outlines a similar semiconductor package structure, emphasizing the arrangement of the semiconductor dies and the incorporation of holes on the substrate's surface.

Career Highlights

Chia-Cheng Chang is currently employed at MediaTek Corporation, a leading company in the semiconductor industry. His expertise in semiconductor packaging has led to numerous advancements and improvements in product design and functionality.

Collaborations

Chang has collaborated with talented coworkers, including Tzu-Hung Lin and I-Hsuan Peng, contributing to the innovative projects at MediaTek Corporation.

Conclusion

Chia-Cheng Chang's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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