The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Dec. 03, 2019
Applicant:
Mediatek Inc., Hsinchu, TW;
Inventors:
Chia-Cheng Chang, Hsinchu, TW;
Tzu-Hung Lin, Hsinchu, TW;
I-Hsuan Peng, Hsinchu, TW;
Yi-Jou Lin, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/053 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/367 (2013.01); H01L 23/49822 (2013.01); H01L 25/165 (2013.01);
Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die and a frame. The semiconductor die is disposed over the substrate. The frame is disposed over the substrate, wherein the frame is adjacent to the semiconductor die, and the upper surface of the frame is lower than the upper surface of the semiconductor die.