Cheng-Yi Hsieh

Title: Cheng-Yi Hsieh: Innovator in Semiconductor Technology

Introduction

Cheng-Yi Hsieh is a prominent inventor based in Jhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative semiconductor devices and manufacturing methods that enhance performance and efficiency.

Latest Patents

One of his latest patents is titled "Semiconductor device and method forming the same." This invention describes a semiconductor device that includes a substrate, a seed layer, a compound semiconductor stack layer, and both source and drain metal layers. Additionally, it features a conductive layer that connects the seed layer and the source metal layer, enhancing the device's functionality.

Another notable patent is "Package structure and method for manufacturing the same." This patent outlines a method for creating a package structure that involves a carrier board and at least one die. The die is designed with a protective layer that covers its side surfaces, ensuring durability and reliability in semiconductor applications.

Career Highlights

Cheng-Yi Hsieh is currently employed at Vanguard International Semiconductor Corporation, where he continues to push the boundaries of semiconductor innovation. His expertise and dedication to research have positioned him as a key player in the industry.

Collaborations

Throughout his career, Cheng-Yi has collaborated with talented individuals such as Hsiu-Mei Yu and Wei-Chan Chang. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Cheng-Yi Hsieh's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of the semiconductor industry.