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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Cheng-Hsien Hsieh

USPTO Granted Patents = 50 

Average Co-Inventor Count = 5.8

ph-index = 9

Forward Citations = 1,158(Granted Patents)

Forward Citations (Not Self Cited) = 1,124(Dec 10, 2025)


Location History:

  • Hsin-Chu, TW (2016 - 2018)
  • Kaohsiung, TW (2016 - 2024)

Company Filing History:

goldMedal50 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2016-2025

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Areas of Expertise:
Integrated Circuit Package
Semiconductor Package
Redistribution Layers
3D Packages
Integrated Passive Device
Conductive Vias
Under Bump Metallurgy
Dummy Features
Three-Dimensional Chip Stack
Surface Mount Device
Manufacturing Method
Package Structures
50 patents (USPTO):Explore Patents
1. 12322726 - Method of forming an integrated circuit package having a padding layer on a carrier (2025-06-03),
2. 12191224 - Semiconductor package and manufacturing method thereof (2025-01-07),
3. 11955439 - Semiconductor package with redistribution structure and manufacturing method thereof (2024-04-09),
4. 11855018 - Semiconductor device and method of manufacture (2023-12-26),
5. 11830745 - 3D packages and methods for forming the same (2023-11-28),
6. 11652063 - Semiconductor package and method of forming the same (2023-05-16),
7. 11612057 - Opening in the pad for bonding integrated passive device in InFO package (2023-03-21),
8. 11581268 - Semiconductor package with redistribution structure and manufacturing method thereof (2023-02-14),
9. 11515229 - Semiconductor package and manufacturing method thereof (2022-11-29),
10. 11508695 - Redistribution layers in semiconductor packages and methods of forming same (2022-11-22),
11. 11470720 - Opening in the pad for bonding integrated passive device in InFO package (2022-10-11),
12. 11195802 - Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof (2021-12-07),
13. 11069625 - Method for forming package structure (2021-07-20),
14. 11069539 - 3D packages and methods for forming the same (2021-07-20),
15. 11018088 - Dummy features in redistribution layers (RDLS) and methods of forming same (2021-05-25),

Title: The Innovative Journey of Cheng-Hsien Hsieh

Introduction: Cheng-Hsien Hsieh, a talented inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Cheng-Hsien Hsieh holds several patents in the areas of electronics and telecommunications, with his most recent patent focusing on a cutting-edge communication device that revolutionizes the way we connect with the world.

Career Highlights: Throughout his illustrious career, Cheng-Hsien Hsieh has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have not only improved the lives of many but have also paved the way for future advancements in the industry.

Collaborations: Cheng-Hsien Hsieh has collaborated with leading tech companies and research institutions to further develop his inventions and bring them to the market. His ability to work effectively in a team setting has led to successful partnerships and groundbreaking innovations.

Conclusion: Cheng-Hsien Hsieh's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor. His contributions to the world of technology continue to inspire and shape the future of the industry.

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