Cheng-En Ho

Title: Innovations of Cheng-En Ho

Introduction

Cheng-En Ho is a prominent inventor based in New Taipei, Taiwan. He holds a total of eight patents, showcasing his significant contributions to the field of technology and materials science. His work primarily focuses on advanced structures and manufacturing methods that enhance the performance and reliability of electronic components.

Latest Patents

One of his latest patents is related to a nanotwinned structure. This innovation involves a nanotwinned structure deposited on a substrate surface, which includes at least one domain with multiple nanotwins. Each nanotwin possesses a face-centered cubic (FCC) structure, and they are stacked along the [111] crystallographic axis. Notably, less than 50% of the nanotwinned structure's surface takes the (111) as the preferred orientation. Another significant patent is a method for manufacturing circuit boards. This method includes preparing a substrate with a resin layer and a stop layer, forming conduction holes, and applying multiple metal layers through various processes. The resulting circuit pattern achieves a line width/pitch of less than 10 micrometers, which is essential for fine electronic applications.

Career Highlights

Cheng-En Ho has worked with notable institutions, including Yuan Ze University and Kinsus Interconnect Technology Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in circuit board technology and materials.

Collaborations

Cheng-En has collaborated with esteemed colleagues such as Cheng-Hsien Yang and Chi-Ming Lin. Their joint efforts have further propelled the research and development of cutting-edge technologies in their respective fields.

Conclusion

Cheng-En Ho's contributions to innovation and technology are evident through his patents and collaborations. His work continues to influence the development of advanced materials and manufacturing techniques in the electronics industry.