The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
May. 10, 2010
Cheng-en Ho, Taipei County, TW;
Chi-ming Lin, Taipei, TW;
Cheng-En Ho, Taipei County, TW;
Chi-Ming Lin, Taipei, TW;
Yuan Ze University, Taoyuan County, TW;
Abstract
A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)Sn) layer at the (Cu,Ni)Sn/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)Snlayer between the (Cu,Ni)Snand nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile